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Amkor Technology Inc (NASDAQ: AMKR)

 
AMKR Technical Analysis
5
As on 30th May 2025 AMKR STOCK Price closed @ 18.02 and we RECOMMEND Strong Sell for LONG-TERM with Stoploss of 32.43 & Strong Sell for SHORT-TERM with Stoploss of 31.66 we also expect STOCK to react on Following IMPORTANT LEVELS.
 
 

AMKRSTOCK Price

Open 18.51 Change Price %
High 18.60 1 Day -0.70 -3.74
Low 17.79 1 Week -1.36 -7.02
Close 18.02 1 Month 1.87 11.58
Volume 3248727 1 Year -12.76 -41.46
52 Week High 44.68 | 52 Week Low 14.88
 
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AMKR
Daily Charts
AMKR
Intraday Charts
Whats New @
Bazaartrend
AMKR
Free Analysis
 
AMKR Important Levels Intraday
RESISTANCE19.58
RESISTANCE19.08
RESISTANCE18.77
RESISTANCE18.46
SUPPORT17.58
SUPPORT17.27
SUPPORT16.96
SUPPORT16.46
 
AMKR Forecast June 2025
4th UP Forecast33.74
3rd UP Forecast28.7
2nd UP Forecast25.58
1st UP Forecast22.47
1st DOWN Forecast13.57
2nd DOWN Forecast10.46
3rd DOWN Forecast7.34
4th DOWN Forecast2.3
 
AMKR Weekly Forecast
4th UP Forecast21.47
3rd UP Forecast20.36
2nd UP Forecast19.68
1st UP Forecast19.00
1st DOWN Forecast17.04
2nd DOWN Forecast16.36
3rd DOWN Forecast15.68
4th DOWN Forecast14.57
 
AMKR Forecast2025
4th UP Forecast77.43
3rd UP Forecast58.38
2nd UP Forecast46.6
1st UP Forecast34.82
1st DOWN Forecast1.22
2nd DOWN Forecast-10.56
3rd DOWN Forecast-22.34
4th DOWN Forecast-41.39
 
 
AMKR Other Details
Segment EQ
Market Capital 5409776128.00
Sector Technology
Industry Semiconductors
Offical website >
 
AMKR Address
AMKR
 
AMKR Latest News
 
Your Comments and Response on Amkor Technology Inc
 
AMKR Business Profile
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; and flip chip ball grid array products for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electro-mechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona. Address: 2045 East Innovation Circle, Tempe, AZ, United States, 85284
 
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