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Amkor Technology Inc (NASDAQ: AMKR)

 
AMKR Technical Analysis
5
As on 9th Dec 2025 AMKR STOCK Price closed @ 44.61 and we RECOMMEND Strong Buy for LONG-TERM with Stoploss of 23.20 & Strong Buy for SHORT-TERM with Stoploss of 25.32 we also expect STOCK to react on Following IMPORTANT LEVELS.
 
 

AMKRSTOCK Price

Open 44.06 Change Price %
High 44.73 1 Day -0.10 -0.22
Low 43.13 1 Week 8.22 22.59
Close 44.61 1 Month 11.43 34.45
Volume 3339549 1 Year 18.17 68.72
52 Week High 44.71 | 52 Week Low 14.88
 
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AMKR
Daily Charts
AMKR
Intraday Charts
Whats New @
Bazaartrend
AMKR
Free Analysis
 
AMKR Important Levels Intraday
RESISTANCE47.69
RESISTANCE46.70
RESISTANCE46.09
RESISTANCE45.48
SUPPORT43.74
SUPPORT43.13
SUPPORT42.52
SUPPORT41.53
 
AMKR Forecast December 2025
4th UP Forecast52.97
3rd UP Forecast50.29
2nd UP Forecast48.63
1st UP Forecast46.98
1st DOWN Forecast42.24
2nd DOWN Forecast40.59
3rd DOWN Forecast38.93
4th DOWN Forecast36.25
 
AMKR Weekly Forecast
4th UP Forecast47.44
3rd UP Forecast46.53
2nd UP Forecast45.97
1st UP Forecast45.41
1st DOWN Forecast43.81
2nd DOWN Forecast43.25
3rd DOWN Forecast42.69
4th DOWN Forecast41.78
 
AMKR Forecast2025
4th UP Forecast104.64
3rd UP Forecast85.39
2nd UP Forecast73.49
1st UP Forecast61.59
1st DOWN Forecast27.63
2nd DOWN Forecast15.73
3rd DOWN Forecast3.83
4th DOWN Forecast-15.42
 
 
AMKR Other Details
Segment EQ
Market Capital 5409776128.00
Sector Technology
Industry Semiconductors
Offical website >
 
AMKR Address
AMKR
 
AMKR Latest News
 
Your Comments and Response on Amkor Technology Inc
 
AMKR Business Profile
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; and flip chip ball grid array products for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electro-mechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona. Address: 2045 East Innovation Circle, Tempe, AZ, United States, 85284
 
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