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Kinsus Interconnect Technology Corp (TW: 3189)
3189 Technical Analysis
5
| As on 13th Mar 2025 3189 STOCK Price closed @ 96.00 and we RECOMMEND Strong Sell for LONG-TERM with Stoploss of 100.24 & Strong Sell for SHORT-TERM with Stoploss of 102.25 we also expect STOCK to react on Following IMPORTANT LEVELS. |
3189STOCK Price
| Open | 100.00 | Change | Price | % |
| High | 100.50 | 1 Day | -2.20 | -2.24 |
| Low | 96.00 | 1 Week | -1.50 | -1.54 |
| Close | 96.00 | 1 Month | -1.70 | -1.74 |
| Volume | 3909742 | 1 Year | -12.50 | -11.52 |
| 52 Week High 132.00 | 52 Week Low 90.20 | ||||
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TW Taiwan Top Gainers Stocks
TW Taiwan Top Losers Stocks
| 3189 Daily Charts |
3189 Intraday Charts |
Whats New @ Bazaartrend |
3189 Free Analysis |
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3189 Important Levels Intraday
| RESISTANCE | 104.67 |
| RESISTANCE | 101.89 |
| RESISTANCE | 100.17 |
| RESISTANCE | 98.45 |
| SUPPORT | 93.55 |
| SUPPORT | 91.83 |
| SUPPORT | 90.11 |
| SUPPORT | 87.33 |
3189 Forecast March 2025
| 4th UP Forecast | 130.3 |
| 3rd UP Forecast | 119.3 |
| 2nd UP Forecast | 112.5 |
| 1st UP Forecast | 105.7 |
| 1st DOWN Forecast | 86.3 |
| 2nd DOWN Forecast | 79.5 |
| 3rd DOWN Forecast | 72.7 |
| 4th DOWN Forecast | 61.7 |
3189 Weekly Forecast
| 4th UP Forecast | 110.45 |
| 3rd UP Forecast | 105.82 |
| 2nd UP Forecast | 102.95 |
| 1st UP Forecast | 100.09 |
| 1st DOWN Forecast | 91.91 |
| 2nd DOWN Forecast | 89.05 |
| 3rd DOWN Forecast | 86.18 |
| 4th DOWN Forecast | 81.55 |
3189 Forecast2025
| 4th UP Forecast | 180.6 |
| 3rd UP Forecast | 153.47 |
| 2nd UP Forecast | 136.7 |
| 1st UP Forecast | 119.93 |
| 1st DOWN Forecast | 72.07 |
| 2nd DOWN Forecast | 55.3 |
| 3rd DOWN Forecast | 38.53 |
| 4th DOWN Forecast | 11.4 |
Kinsus Interconnect Technology Corp ( TW Taiwan Symbol : 3189 )
Sector : Technology And Other Stocks in Same Sector
Sector : Technology And Other Stocks in Same Sector
3189 Business Profile
Kinsus Interconnect Technology Corp. primarily researches, develops, designs, manufactures, and sells electronic products in Taiwan and internationally. The company operates in two segments, IC Substrate and Printed Circuit Board (PCB). It offers plastic ball grid array, multi-chip-module ball grid array (BGA), chip scale package (CSP) mini-BGA, high dissipation cavity down, thermal enhanced BGA, flip chip, flip chip CSP, flip chip film chip on flex, core-less, all layer build up, embedded pattern and passive, high density copper bump, high band width package-on-package, core-less embedded passive, and radio frequency module substrates. The company also provides system in package, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly; and PCBs and related products, and electronic components, as well as after sales services. In addition, the company is involved in the wholesale and retail-sale of electronic materials; sale of medical equipment; provision of consultation services for business operation and management; and investment and trading activities. Its products are used for modules in handset and wearable devices, microprocessors, controllers, graphic and application processors, ASIC, PC chipsets, connectivity, power management, memory, power amplifier, front end and WiFi connectivity modules, and field programmable gate array applications. The company primarily serves IC packaging, design, and system businesses, as well as manufacturers of electronic products. The company was founded in 2000 and is headquartered in Taoyuan City, Taiwan. Address: No.1245, Zhonghua Road, Taoyuan City, Taiwan, 327
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