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Chipbond Technology (TWO: 6147)
6147 Technical Analysis
4
| As on 14th Jan 2026 6147 STOCK Price closed @ 57.00 and we RECOMMEND Sell for LONG-TERM with Stoploss of 59.92 & Strong Sell for SHORT-TERM with Stoploss of 63.99 we also expect STOCK to react on Following IMPORTANT LEVELS. |
6147STOCK Price
| Open | 57.00 | Change | Price | % |
| High | 57.70 | 1 Day | 1.00 | 1.79 |
| Low | 56.30 | 1 Week | 4.30 | 8.16 |
| Close | 57.00 | 1 Month | 4.00 | 7.55 |
| Volume | 6430309 | 1 Year | -7.50 | -11.63 |
| 52 Week High 67.10 | 52 Week Low 51.40 | ||||
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TWO Taiwan Top Gainers Stocks
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| 6147 Daily Charts |
6147 Intraday Charts |
Whats New @ Bazaartrend |
6147 Free Analysis |
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6147 Important Levels Intraday
| RESISTANCE | 59.70 |
| RESISTANCE | 58.83 |
| RESISTANCE | 58.30 |
| RESISTANCE | 57.76 |
| SUPPORT | 56.24 |
| SUPPORT | 55.70 |
| SUPPORT | 55.17 |
| SUPPORT | 54.30 |
6147 Forecast January 2026
| 4th UP Forecast | 64.9 |
| 3rd UP Forecast | 62.37 |
| 2nd UP Forecast | 60.8 |
| 1st UP Forecast | 59.23 |
| 1st DOWN Forecast | 54.77 |
| 2nd DOWN Forecast | 53.2 |
| 3rd DOWN Forecast | 51.63 |
| 4th DOWN Forecast | 49.1 |
6147 Weekly Forecast
| 4th UP Forecast | 61.82 |
| 3rd UP Forecast | 60.27 |
| 2nd UP Forecast | 59.32 |
| 1st UP Forecast | 58.36 |
| 1st DOWN Forecast | 55.64 |
| 2nd DOWN Forecast | 54.68 |
| 3rd DOWN Forecast | 53.73 |
| 4th DOWN Forecast | 52.18 |
6147 Forecast2026
| 4th UP Forecast | 89.37 |
| 3rd UP Forecast | 78.99 |
| 2nd UP Forecast | 72.57 |
| 1st UP Forecast | 66.16 |
| 1st DOWN Forecast | 47.84 |
| 2nd DOWN Forecast | 41.43 |
| 3rd DOWN Forecast | 35.01 |
| 4th DOWN Forecast | 24.63 |
Chipbond Technology ( TWO Taiwan Symbol : 6147 )
Sector : Technology And Other Stocks in Same Sector
Sector : Technology And Other Stocks in Same Sector
6147 Business Profile
Chipbond Technology Corporation, together with its subsidiaries, provides services for backend assembly processing of LCD driver integrated circuits (ICs) in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components, as well as tape automated bonding, tape carrier, and others. Chipbond Technology Corporation was founded in 1997 and is headquartered in Hsinchu, Taiwan. Address: No. 3, Lising 5 Road, Hsinchu City, Taiwan, 300
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