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Chipbond Technology (TWO: 6147)

 
6147 Technical Analysis
5
As on 9th Jun 2023 6147 STOCK Price closed @ 69.90 and we RECOMMEND Strong Buy for LONG-TERM with Stoploss of 62.68 & Strong Buy for SHORT-TERM with Stoploss of 67.63 we also expect STOCK to react on Following IMPORTANT LEVELS.
 
 

6147STOCK Price

Open 69.50 Change Price %
High 70.00 1 Day 0.20 0.29
Low 69.40 1 Week 2.90 4.33
Close 69.90 1 Month 2.60 3.86
Volume 4221089 1 Year 2.30 3.40
52 Week High 72.60 | 52 Week Low 49.45
 
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3374 128.00 9.87%
2743 162.50 -7.93%
8069 227.00 5.09%
1815 13.95 6.08%
 
TWO Taiwan Top Gainers Stocks
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4543 57.60 9.92%
3078 72.00 9.92%
6122 44.45 9.89%
6122 44.45 9.89%
6148 38.40 9.87%
 
TWO Taiwan Top Losers Stocks
6174 27.70 -10.65%
1796 114.00 -9.88%
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1580 124.50 -5.32%
1580 124.50 -5.32%
3522 18.35 -4.92%
3252 25.20 -4.73%
 
 
6147
Daily Charts
6147
Intraday Charts
Whats New @
Bazaartrend
6147
Free Analysis
 
6147 Important Levels Intraday
RESISTANCE71.06
RESISTANCE70.69
RESISTANCE70.46
RESISTANCE70.23
SUPPORT69.57
SUPPORT69.34
SUPPORT69.11
SUPPORT68.74
 
6147 Forecast April 2024
4th UP Forecast83
3rd UP Forecast78.8
2nd UP Forecast76.2
1st UP Forecast73.61
1st DOWN Forecast66.19
2nd DOWN Forecast63.6
3rd DOWN Forecast61
4th DOWN Forecast56.8
 
6147 Weekly Forecast
4th UP Forecast74.91
3rd UP Forecast73.30
2nd UP Forecast72.31
1st UP Forecast71.32
1st DOWN Forecast68.48
2nd DOWN Forecast67.49
3rd DOWN Forecast66.50
4th DOWN Forecast64.89
 
6147 Forecast2024
4th UP Forecast116.53
3rd UP Forecast101.58
2nd UP Forecast92.33
1st UP Forecast83.09
1st DOWN Forecast56.71
2nd DOWN Forecast47.47
3rd DOWN Forecast38.22
4th DOWN Forecast23.27
 
 
6147 Other Details
Segment EQ
Market Capital 43313233920.00
Sector Technology
Industry Semiconductors
Offical website >
 
6147 Address
6147
 
6147 Latest News
 
Your Comments and Response on Chipbond Technology
 
6147 Business Profile
Chipbond Technology Corporation, together with its subsidiaries, provides services for backend assembly processing of LCD driver integrated circuits (ICs) in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components, as well as tape automated bonding, tape carrier, and others. Chipbond Technology Corporation was founded in 1997 and is headquartered in Hsinchu, Taiwan. Address: No. 3, Lising 5 Road, Hsinchu City, Taiwan, 300
 
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