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Chipbond Technology (TWO: 6147)

 
6147 Technical Analysis
4
As on 23rd Jan 2026 6147 STOCK Price closed @ 57.90 and we RECOMMEND Sell for LONG-TERM with Stoploss of 59.92 & Strong Sell for SHORT-TERM with Stoploss of 63.99 we also expect STOCK to react on Following IMPORTANT LEVELS.
 
 

6147STOCK Price

Open 58.20 Change Price %
High 58.20 1 Day 0.10 0.17
Low 56.90 1 Week 0.90 1.58
Close 57.90 1 Month 5.30 10.08
Volume 2700005 1 Year -6.60 -10.23
52 Week High 67.10 | 52 Week Low 51.40
 
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6182 38.70 -1.02%
 
TWO Taiwan Top Gainers Stocks
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5291 38.40 9.87%
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4534 21.75 9.85%
6716 50.80 9.84%
 
TWO Taiwan Top Losers Stocks
3202 3.96 -10.00%
4939 46.20 -9.94%
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8277 10.80 -8.86%
8277 10.80 -8.86%
3624 62.00 -8.28%
5328 28.95 -7.51%
 
 
6147
Daily Charts
6147
Intraday Charts
Whats New @
Bazaartrend
6147
Free Analysis
 
6147 Important Levels Intraday
RESISTANCE60.41
RESISTANCE59.60
RESISTANCE59.11
RESISTANCE58.61
SUPPORT57.19
SUPPORT56.69
SUPPORT56.20
SUPPORT55.39
 
6147 Forecast January 2026
4th UP Forecast67.73
3rd UP Forecast64.58
2nd UP Forecast62.63
1st UP Forecast60.68
1st DOWN Forecast55.12
2nd DOWN Forecast53.17
3rd DOWN Forecast51.22
4th DOWN Forecast48.07
 
6147 Weekly Forecast
4th UP Forecast61.95
3rd UP Forecast60.65
2nd UP Forecast59.85
1st UP Forecast59.04
1st DOWN Forecast56.76
2nd DOWN Forecast55.95
3rd DOWN Forecast55.15
4th DOWN Forecast53.85
 
6147 Forecast2026
4th UP Forecast90.27
3rd UP Forecast79.89
2nd UP Forecast73.47
1st UP Forecast67.06
1st DOWN Forecast48.74
2nd DOWN Forecast42.33
3rd DOWN Forecast35.91
4th DOWN Forecast25.53
 
 
6147 Other Details
Segment EQ
Market Capital 43313233920.00
Sector Technology
Industry Semiconductors
Offical website >
 
6147 Address
6147
 
6147 Latest News
 
Your Comments and Response on Chipbond Technology
 
6147 Business Profile
Chipbond Technology Corporation, together with its subsidiaries, provides services for backend assembly processing of LCD driver integrated circuits (ICs) in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components, as well as tape automated bonding, tape carrier, and others. Chipbond Technology Corporation was founded in 1997 and is headquartered in Hsinchu, Taiwan. Address: No. 3, Lising 5 Road, Hsinchu City, Taiwan, 300
 
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