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Chipbond Technology (TWO: 6147)

 
6147 Technical Analysis
4
As on 21st Jan 2026 6147 STOCK Price closed @ 57.70 and we RECOMMEND Sell for LONG-TERM with Stoploss of 59.92 & Strong Sell for SHORT-TERM with Stoploss of 63.99 we also expect STOCK to react on Following IMPORTANT LEVELS.
 
 

6147STOCK Price

Open 59.20 Change Price %
High 59.50 1 Day -1.80 -3.03
Low 57.70 1 Week 2.40 4.34
Close 57.70 1 Month 4.00 7.45
Volume 3817865 1 Year -6.80 -10.54
52 Week High 67.10 | 52 Week Low 51.40
 
TWO Taiwan Most Active Stocks
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3105 222.00 -2.20%
6217 61.00 -4.39%
5371 96.70 3.98%
 
TWO Taiwan Top Gainers Stocks
8933 8.80 10.00%
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4171 21.50 9.97%
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4533 32.15 9.91%
3234 51.10 9.89%
1569 56.90 9.85%
1569 56.90 9.85%
 
TWO Taiwan Top Losers Stocks
3264 148.50 -10.00%
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3372 23.70 -7.60%
5328 31.10 -7.44%
3221 25.45 -7.12%
6122 58.70 -6.38%
 
 
6147
Daily Charts
6147
Intraday Charts
Whats New @
Bazaartrend
6147
Free Analysis
 
6147 Important Levels Intraday
RESISTANCE61.17
RESISTANCE60.06
RESISTANCE59.37
RESISTANCE58.68
SUPPORT56.72
SUPPORT56.03
SUPPORT55.34
SUPPORT54.23
 
6147 Forecast January 2026
4th UP Forecast67.53
3rd UP Forecast64.38
2nd UP Forecast62.43
1st UP Forecast60.48
1st DOWN Forecast54.92
2nd DOWN Forecast52.97
3rd DOWN Forecast51.02
4th DOWN Forecast47.87
 
6147 Weekly Forecast
4th UP Forecast62.52
3rd UP Forecast60.97
2nd UP Forecast60.02
1st UP Forecast59.06
1st DOWN Forecast56.34
2nd DOWN Forecast55.38
3rd DOWN Forecast54.43
4th DOWN Forecast52.88
 
6147 Forecast2026
4th UP Forecast90.07
3rd UP Forecast79.69
2nd UP Forecast73.27
1st UP Forecast66.86
1st DOWN Forecast48.54
2nd DOWN Forecast42.13
3rd DOWN Forecast35.71
4th DOWN Forecast25.33
 
 
6147 Other Details
Segment EQ
Market Capital 43313233920.00
Sector Technology
Industry Semiconductors
Offical website >
 
6147 Address
6147
 
6147 Latest News
 
Your Comments and Response on Chipbond Technology
 
6147 Business Profile
Chipbond Technology Corporation, together with its subsidiaries, provides services for backend assembly processing of LCD driver integrated circuits (ICs) in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components, as well as tape automated bonding, tape carrier, and others. Chipbond Technology Corporation was founded in 1997 and is headquartered in Hsinchu, Taiwan. Address: No. 3, Lising 5 Road, Hsinchu City, Taiwan, 300
 
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